Syllabus

Course Meeting Times

Lectures: 2 theorical sessions / week, 1 hours / session
Laboratory: 2 lab. sessions / week, 2 hours / session

Course Goals

This course intends to help you develop the capability of systems thinking by introducing classical and advanced systems engineering theory, methods, and tools. After taking this class, the student should be able to:

  • To read and understand datasheets and articles from the main PCB technological papers.
  • To make a public presentation of one among the themes of the course and be able to answer the questions emerged in the discussion.
  • To relate mechanical and electronic results with product manufacturing procedures.
  • Understand the concepts and nomenclature of the design and manufacturing soldering technology in micrometer and millimetre scale.
  • Find the conditioning elements of the technology in order to make the PCB designs for general and specific applications.
  • To choose the different electronic components in a circuit depending on the technique used for industrial manufacturing.
  • Satisfy the standards and quality criteria in the design of printed circuits.
  • Achieve introductory knowledge for different manufacturing technologies and industrial production PCBs.
  • To know and manage CAD tools for obtaining lithography masks and chemical processes required during manufacturing.
  • Learn and design easy CAD models of 3D printing oriented electronic products.
  • Read into technical specifications of electronic equipment and write technical documentation.
  • Apply the technological concepts needed to optimize production times depending on the available processes in the manufacturing line.
  • Ability to apply mathematical concepts to optimize the costs of manufacture and assembly of printed circuit boards during industrialization in outside plant.

Reading Materials

Required Textbooks

Have a look at Readings Link

BASIC BIBLIOGRAPHY

• Jon Varteresian, Fabricating Printed Circuit Boards,  Newnes, 2002
• R. Tummala, Fundamentals of Microsystems Packaging, McGraw-Hill 2001
• Mark Madou, Fundamentals of Microfabrication, CRC Press, ISBN: 0-8493-9451-1
• Elaine Rhodes, Developing Printed Circuit Assemblies: From Specifications to Mass Production, 2008
• C. Robertson. PCB Designer´s Reference. Prentice Hall, 2003
C. Coombs, Printed Circuits Handbook, McGraw-Hill Professional, 6 edition, 2007

COMPLEMENTARY BIBLIOGRAPHY:

V. Shukla,  Signal Integrity for PCB Designers, Reference Designer, 2009
D. Brooks, Signal Integrity Issues and Printed Circuit Board Design, Prentice Hall, 2003

B. Archambeault, J. Dreuiawniak, PCB Design for Real-World EMI Control, Springer, 2002

Overall Semester Plan

MODULE 1:  Printed Circuit Boards

UNIT 1. Historical Review
UNIT 2. Component packages
UNIT 3. Design Rules
UNIT 4. Electrical and Mechanical Design

MODULE 2: Electronic Product Fabrication

UNIT 5. PCB and Fabrication Technology
UNIT 6. PCB Documentation

Class Sessions & Workload

An important thing about the lectures, and about the course in general, is that the lecturers will ask for your participation. For every lecture, there will be readings assigned. The readings are focused on the lecture's theme; some were written especially for it. Please read them and come prepared to class because only then will you be able to participate in the class and benefit from what the faculty and your fellow students say.

Modality

Names

Hours

ECTS

%

In-class work activities

 

60

2.4

40%

Theoretical classes

Theory

30

1.2

20%

Practical classes

Professional skills practice

22

0.88

15%

ECTS tutorials

Group tutorials

5

0.2

3%

Assessment

Assessment

3

0.12

2%

 

 

 

 

 

Distance education work activities

 

90

3.6

60%

Individual self-study

Progress assessment tasks

45

1.8

30%

Individual self-study

Working on theory contents

40

1.6

27%

Group self-study

Preparatory work for practical sessions

5

0.2

3%

 

Total

150

6

100%

Attendance

Attendance at large group lectures is mandatory.
Attendance at small group classes is mandatory.
Attendance at seminars and realization of autonomous work will be mandatory for those students wishing this part to be assessed.

Grading

ACTIVITIES PERCENTAGES
Individual integrated project
10%
Mid-term team project presentation
10%
Final team project presentation
10%
Semminars - Instructor Student
10%
Exams
60%

To pass the course will be necessary to pass both the theoretical, practical and seminar parts.

• For students qualifying for the final single assessment. This type of assessment will consist of all the evidence to prove that the student has acquired all of the general and specific skills described in the corresponding section of this Course Guide, including at least a theory and a practical laboratory production test. The final numerical grade will be obtained by the weighted sum of the ratings corresponding to a theoretical, the practical test.

All matters relating to the assessment will be governed by the Student Evaluation and Qualification Policy at the University of Granada, which is available at this WEB URL.  All matters relating to the assessment will be governed by the rules on teacher planning and organization of existing tests at the University of Granada.

The grading system is expressed by numerical rating according to the provisions of art. 5 of R.D. 1125/2003 of 5 September, establishing the European credit system and grading system of official university degrees and valid national territory is established.

Academic Guide of the Course: Printed Circuit Technology This resource may not render correctly in a screen reader. 2016-17